Thermalright TF8 High-Performance Thermal Paste

Maximise cooling efficiency with the Thermalright TF8 Thermal Paste, a high-performance thermal compound designed to improve heat transfer between processors and cooling solutions. Suitable for desktop PCs, laptops, graphics cards and gaming systems, TF8 helps maintain lower operating temperatures for stable, reliable performance.

With a thermal conductivity rating of up to 13.8 W/m·K, this non-conductive thermal compound efficiently fills microscopic gaps between the processor and heatsink, improving thermal contact without the risk associated with electrically conductive pastes.

Its smooth consistency allows for easy application, while the included applicator helps achieve an even coating for optimal performance. Whether upgrading, maintaining or building a new computer, TF8 provides dependable long-term cooling for demanding applications.

Key Features

• High-performance TF8 thermal compound
• Thermal conductivity up to 13.8 W/m·K
• Electrically non-conductive for added safety
• Suitable for CPUs, GPUs and laptop processors
• Improves heat transfer between processor and heatsink
• Smooth, easy-to-apply consistency
• Includes application spatula for even spreading
• Low thermal impedance for efficient cooling
• Long-lasting durability
• Operating temperature range: -220°C to +380°C
• Grey thermal compound
• Suitable for gaming PCs, workstations and custom builds
• Compatible with desktop computers, laptops and graphics cards
• Available in 1.2 g and 2 g capacities
• Backed by a 6-year manufacturer warranty

Technical Specifications

• Model: Thermalright TF8
• Type: Thermal Grease
• Thermal Conductivity: 13.8 W/m·K
• Thermal Impedance: <0.01 °C·cm²/W
• Specific Gravity (25°C): 2.9
• Electrical Conductivity: Non-conductive
• Colour: Grey
• Operating Temperature: -220°C to +380°C

Package Includes

• 1 × Thermalright TF8 Thermal Paste
• 1 × Application Spatula